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lite-on dcc release lite-on technology corp. / optoelectronics no.90,chien 1 road, chung ho, new taipei city 23585, taiwan, r.o.c. tel: 886-2-2222-6181 fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto through hole lamp product data sheetLTL4VMEPADS1-032A spec no.: ds20-2012-0145effective date: 10/25/2012revision: - bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y features * lead (pb) free product and rohs compliant. * high luminous intensity output. * low power consumption. * high efficiency. * versatile mounting on p.c. board or panel. * i.c. compatible/low current requirements. * widely viewing angle. pack age dimensions part no. lens source color ltl4vmepads 1 - 032a red diffused alingap red notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25mm(.010") unless otherwise noted. 3. lead spacing is measured where the lea ds emerge from the package. 4. specifications are subject to change without notice. part no. : ltl4vmepads 1 - 032a page : 1 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y absolute maximum ratings at t a =25c parameter maximum rating unit power dissipa tion 120 mw peak forward current (1/10 duty cycle, 0.1ms pulse width) 90 ma continuous forward current 50 ma derating linear from 3 0c 0. 64 ma/c operating temperature range - 40c to + 8 5 c storage temperature range - 40 c to + 100c lead soldering temperature [2.0mm(.078") from body] 260c for 5 seconds part no. : ltl4vmepads 1 - 032a page : 2 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y electrical / optical characteristics at t a =25 c parameter symbol min. typ. max. unit test co ndition luminous intensity i v 1000 1350 mcd i f = 20ma note 1,5 viewing angle 2 1/2 50/110 deg i f = 20ma note 2 (fig.6 ) peak emission wavelength p 626 nm i f = 20ma measurement @peak (fig.1) dominant wavelength d 619 623 629 nm i f = 20ma , note 4 spectral line half - width ? 15 nm i f = 20ma forward voltage v f 1.8 2.1 2. 4 v i f = 20ma reverse current i r 100 a v r = 5v note: 1. luminous intensity is measured with a light sensor and filter combination that approximates the cie eye - response curve. 2. 1/2 is the off - axis angle at which the luminous intensity is half the axial luminous intensity. 3. iv classification code is marked on each packing bag. 4. the dominant wavelength, d is derived from the cie chromaticity diagram and represents the s ingle wavelength which defines the color of the device. 5. the iv guarantee should be added 15% . part no. : ltl4vmepads 1 - 032a page : 3 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y typical electrical / optical characteris tics curves (25 c ambient temperature unless otherwise noted) part no. : ltl4vmepads 1 - 032a page : 4 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y features * compatible with radial lead automatic insertion equipment. * most radial lead plastic lead lamps available packaged in tape and folding. * 2.54mm (0.1") straight lead spacing available. * folding packaging simplifies handling and testing. * ammo packing series lamp type 24 led+gap. package dimensions specification item symbol minim um maximum mm inch mm inch tape feed hole diameter d 3.8 0.149 4.2 0.165 component lead pitch f 2.3 0.091 3.0 0.118 front to rear deflection h -- -- 2.0 0.078 feed hole to bottom of component h1 20.0 0.787 21.0 0.827 feed hole to overall component height h2 26.0 1.024 27.6 1.087 lead length after component height l w0 11.0 0.433 feed hole pitch p 12.4 0.488 13.0 0.511 lead locat ion p1 4.4 0.173 5.8 0.228 center of component location p2 5.05 0.198 7.65 0.301 total tape thickness t -- -- 0.90 0.035 feed hole location w0 8.5 0.334 9.75 0.384 adhesive tape position w2 0 0 3.0 0.118 tape width w3 17.5 0.689 19.0 0.748 part no. : ltl4vmepads 1 - 032a page : 5 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y packing spec 2500 pcs per inner carton 10 inner cartons per outer carton total 25000 pcs per outer carton in every shipp ing lot, only the last pack will be non - full packing part no. : ltl4vmepads 1 - 032a page : 6 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y bin table specification luminous intensity iv(mcd) i f @ 2 0ma bin code min. max. q 1000 1350 note: tolerance of each bin limit is 15% dominant wavelength d (nm) i f @2 0ma bin code min. max. r1 619 624 r2 624 629 note: tolerance of each bin limit is 1nm part no. : ltl4vmepads 1 - 032a page : 7 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y cautions 1. application the leds described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).consult liteons sales in advance for information on applications in which exceptional reliability is req uired, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 2. storage the storage ambient for the leds should not exceed 30c temperature or 70% relative humidity. it is recommended that leds out of their original packaging are used within three months. for extended storage out of their original packaging, it is recommended that the leds be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient. 3. cleaning use alcohol - based cleaning solvents such as isopropyl alcohol to clean the leds if necessary. 4. lead forming & assembly during lead forming, the leads s hould be bent at a point at least 3mm from the base of led lens. do not use the base of the lead frame as a fulcrum during forming. lead forming must be done before soldering, at normal temperature. during assembly on pcb, use minimum clinch force possibl e to avoid excessive mechanical stress. 5. soldering when soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point. dipping the lens into the solder must be avoided. do not apply any external stress to the lead frame during soldering while the led is at high temperature. recommended soldering conditions : soldering iron wave soldering temperature soldering time 35 0c max. 3 sec. max. (one time only) pre - heat pre - heat time solder wave sold ering time 100c max. 60 sec. max. 260c max. 5 sec. max. note: excessive soldering temperature and/or time might result in deformation of the led lens or catastrophic failure of the led. ir reflow is not suitable process for through hole type led lamp product. part no. : ltl4vmepads 1 - 032a page : 8 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y 6. drive method an led is a current - operated device. in order to ensure intensity uniformity on multiple leds connected in parallel in an applicati on, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each led as shown in circuit a below. circuit model a circuit model b (a) recommended circuit (b) the brightness of each led might appear different due to the differences in the i - v characteristics of those leds 7. esd (electrostatic d ischarge) static electricity or power surge will damage the led. suggestions to prevent esd damage: ? use a conductive wrist band or anti - electrostatic glove when handling these leds ? all devices, equipment, and machinery must be properly grounded ? work tabl es, storage racks, etc. should be properly grounded ? use ion blower to neutralize the static charge which might have built up on surface of the leds plastic lens as a result of friction between leds during storage and handing part no. ltl4vmepads 1 - 032a page : 9 of 11 bns - od - c131/a4 led led
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y suggested checking list : training and certification 1. everyone working in a static - safe area is esd - certified? 2. training records kept and re - certification dates monitored? static - safe workstatio n & work areas 1. static - safe workstation or work - areas have esd signs? 2. all surfaces and objects at all static - safe workstation and within 1 ft measure less than 100v? 3. all ionizer activated, positioned towards the units? 4. each work surface mats grounding is good? personnel grounding 1. every person (including visitors) handling esd sensitive (esds) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 2. if conductive footwear used, conductive flooring also pr esent where operator stand or walk? 3. garments, hairs or anything closer than 1 ft to esd items measure less than 100v*? 4. every wrist strap or heel strap/conductive shoes checked daily and result recorded for all dl s ? 5. all wrist strap or heel st rap checkers calibration up to date? note: *50v for blue led. device handling 1. every esds items identified by eia - 471 labels on item or packaging? 2. all esds items completely inside properly closed static - shielding containers when not at static - safe workstation? 3. no static charge generators (e.g. plastics) inside shielding containers with esds items? 4. all flexible conductive and dissipative package materials inspected before reuse or recycle? others 1. audit result reported to e ntity esd control coordinator? 2. corrective action from previous audits completed? 3. are audit records complete and on file? part no. : ltl4vmepads 1 - 032a page : 10 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y 8 . reliability test classif ication test item test condition sample size reference standard endurance test operation life ta = 25 c if = 50ma * test time= 1000hrs 45 pcs (cl=90%; ltpd=5%) mil - std - 750d:1026 (1995) mil - std - 883g:1005 (2006) high temperature/ high humidity storage (thb) ta = 85 c rh = 85% * test time= 1000hrs 45 pcs (cl=90%; ltpd=5%) mil - std - 202g:103b (2002) jeita ed - 4701:100 103 (2001) steady state operation life of high humidity heat ta = 85c, rh= 85 % if = 20ma *test time= 500hrs 76 pcs (cl=90% ; ltpd=3%) jesd22 - a101c (2009) low temperature operation life of ta = - 30 c if = 50ma * test time= 1000hrs 45 pcs (cl=90%; ltpd=5%) high temperature storage ta= 105 5 c * test time= 1000hrs 45 pcs (cl=90%; ltpd=5%) mil - std - 750d:1031 (1995 ) mil - std - 883g:1008 (2006) jeita ed - 4701:200 201 (2001) low temperature storage ta= - 55 5 c * test time= 1000hrs 45 pcs (cl=90%; ltpd=5%) jeita ed - 4701:200 202 (2001) environmental test temperature cycling 100 c 25 c - 40 c 25 c 30mins 5mins 30mins 5mins *test time: 200 cycles 76 pcs (cl=90%; ltpd=3%) mil - std - 750d:1051 (1995) mil - std - 883g:1010 (2006) jeita ed - 4701:100 105 (2001) jesd22 - a104c (2005) thermal shock 100 5 c - 30 c 5 c 15mi ns 15mins *test time: 200 cycles (<20 secs transfer) 76 pcs (cl=90%; ltpd=3%) mil - std - 750d:1056 (1995) mil - std - 883g:1011 (2006) mil - std - 202g:107g (2002) jesd22 - a106b (2004) solder resistance t.sol = 260 5 c dwell time= 101 seconds 3mm from the base of the epoxy bulb 11 pcs (cl=90%; ltpd=18.9%) mil - std - 750d:2031(1995) jeita ed - 4701: 300 302 (2001) solderability t. sol = 245 5 c dwell time= 5 0.5 seconds (lead free solder, coverage R 95% of the dipped surface) 11 pcs (cl=90%; lt pd=18.9%) mil - std - 750d:2026 (1995) mil - std - 883g:2003 (2006) mil - std - 202g:208h (2002) ipc/eia j - std - 002 (2004) soldering iron t. sol = 350 5 c dwell time= 3.5 0.5 seconds 11 pcs (cl=90%;l tpd=18.9% ) mil - std - 202g:208h (2002) jeita ed - 4701:300 302 (2 001) 9. others the appearance and specifications of the product may be modified for improvement, without prior notice. part no. : ltl4vmepads 1 - 032a page : 11 of 11 bns - od - c131/a4

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